Wafer transport assembly with integrated buffers

ABSTRACT

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present disclosure is a continuation of U.S. patent application Ser.No. 15/951,333, filed on Apr. 12, 2018, which is a continuation of U.S.patent application Ser. No. 14/887,935, filed on Oct. 20, 2015. Theentire disclosure of the application referenced above is incorporatedherein by reference.

FIELD

The present embodiments relate to semiconductor wafer processingequipment, and more particularly, to multi-chamber process tool systems,apparatus, and associated methods.

BACKGROUND

In a semiconductor fabrication facility (commonly referred to as a“fab”) space is limited and expensive, and cannot be readily increased.Therefore, efficient space utilization is desired in order to achievemaximum productivity. However, it is also necessary to provide adequateaccess to equipment in the fab for maintenance and service.

It is in this context that embodiments of the inventions arise.

SUMMARY

A wafer transport assembly includes a first wafer transport module and asecond wafer transport module. A buffer module, arranged between thefirst wafer transport module and the second wafer transport module,includes a first buffer stack and a second buffer stack. Outer sides ofthe first wafer transport module are coupled to first and second processmodules, respectively, and outer sides of the second wafer transportmodule are coupled to third and fourth process modules, respectively.The first wafer transport module, the second wafer transport module, andthe buffer module define a continuous wafer transport volume providing acontrolled environment within the wafer transport assembly.

In other features, the wafer transport assembly is configured to definea transport path for a wafer from one of the first or second processmodules to the first wafer transport module, to one of the first orsecond buffer stacks, to the second wafer transport module, and to oneof the third or fourth process modules.

In other features, each of the first buffer stack and the second bufferstack is configured to store 5 to 10 wafers. The controlled environmentdefines a vacuum controlled environment. The first buffer stack and thesecond buffer stack define a plurality of wafer storage slots. At leastone of the wafer storage slots is configured to store at least one of acover wafer and a seasoning wafer in the controlled environment.

In other features, the buffer module defines a first protrusion and asecond protrusion that project outwardly from the wafer transportassembly adjacent to the first buffer stack and the second buffer stack,respectively. The first processing module is arranged immediatelyadjacent to the third processing module. The second processing module isarranged immediately adjacent to the fourth processing module. The firstprocessing module and the third processing module define a first recessfor receiving the first protrusion. The second processing module and thefourth processing module define a second recess for receiving the secondprotrusion.

In other features, a second buffer module, arranged between the secondwafer transport module and a third wafer transport module, includes athird buffer stack and a fourth buffer stack. Outer sides of the thirdwafer transport module are coupled to a fifth process module and a sixthprocess module, respectively.

In other features, the second buffer module defines a third protrusionand a fourth protrusion that project outwardly from the wafer transportassembly adjacent to the third buffer stack and the fourth buffer stack,respectively. The third processing module is arranged immediatelyadjacent to the fifth processing module. The fourth processing module isarranged immediately adjacent to the sixth processing module. The thirdprocessing module and the fifth processing module define a third recessfor receiving the third protrusion. The fourth processing module and thesixth processing module define a fourth recess for receiving the fourthprotrusion.

In other features, the wafer transport assembly is defined over aservice tunnel that extends from a front end of the wafer transportassembly to a rear end of the wafer transport assembly. First, second,third and fourth gas boxes arranged in the continuous wafer transportvolume and configured to deliver gas mixtures to the first, second,third and fourth process modules, respectively. An exhaust ductselectively evacuates the first, second, third and fourth processmodules. The first, second, third and fourth gas boxes includeperforations along surfaces thereof such that gases are evacuated fromthe first, second, third and fourth gas boxes into the exhaust duct.

In other features, a plurality of gas lines supply gases to the first,second, third and fourth gas boxes. The plurality of gas lines runsthrough the exhaust duct to the first, second, third and fourth gasboxes. The plurality of gas lines supply the first, second, third andfourth gas boxes run in the exhaust duct from a region outside of thecontinuous wafer transport volume to a region inside of the continuouswafer transport volume.

In other features, a service tunnel is defined underneath the wafertransport assembly. The service tunnel has a vertical dimension definedbetween an underside of the wafer transport assembly and a service floorthat is positioned underneath the wafer transport assembly. The servicefloor is defined at a height that is less than a height of a fabricationfacility floor. The height of the service floor is between 30.5 cm to 61cm below the height of the fabrication facility floor. A height of theservice tunnel is in a range from 183 cm to 244 cm.

In other features, a first portion of the first buffer stack defines afirst plurality of wafer storage slots and includes one or moreseparators defined between each of the first plurality of wafer storageslots. A second portion of the first buffer stack defines a secondplurality of wafer storage slots that does not include separatorsdefined between each of the second plurality of wafer storage slots.

At least one of the first wafer transport module and the second wafertransport module stores at least one of a seasoning wafer and a coverwafer in the second portion of the first buffer stack and at least oneof a processed wafer and an unprocessed wafer in the first portion ofthe first buffer stack.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A conceptually illustrates a cross-section of a portion of acluster tool for processing wafers, in accordance with implementationsof the disclosure.

FIG. 1B illustrates a perspective view of a cluster tool system, inaccordance with implementations of the disclosure.

FIG. 10 illustrates a perspective view of a cluster tool system, inaccordance with implementations of the disclosure.

FIG. 1D illustrates a cross-section view of a cluster tool system, inaccordance with implementations of the disclosure.

FIG. 1E conceptually illustrates a cross-section of a portion of acluster tool for processing wafers, in accordance with implementationsof the disclosure.

FIG. 1F illustrates a cut-away view of a cluster tool for processingwafers, in accordance with implementations of the disclosure.

FIG. 2 illustrates an overhead view of a cluster tool system,illustrating conceptual cutaways of various equipment pieces of thesystem, in accordance with implementations of the disclosure.

FIG. 3A is a perspective view of a wafer transport assembly, inaccordance with implementations of the disclosure.

FIG. 3B illustrates a perspective view of the wafer transport assemblyof FIG. 3A, without the cover plates installed, so as to provide a viewof the interior of the wafer transport assembly, in accordance withimplementations of the disclosure.

FIG. 4A illustrates a perspective view of a wafer transport module, inaccordance with implementations of the disclosure.

FIG. 4B illustrates a perspective view of the wafer transport module 102with a buffer module 410 attached thereto, in accordance withimplementations of the disclosure.

FIG. 5 conceptually illustrates a cross section view of a buffer stack500, in accordance with implementations of the disclosure.

FIG. 6 illustrates a cross section view of a portion of a buffer module,showing a buffer stack, in accordance with implementations of thedisclosure.

FIG. 7 illustrates a cluster tool system, highlighting the orientationof a wafer as it is moved through various components of the system, inaccordance with implementations of the disclosure.

FIG. 8 illustrates a cross section view of a portion of a cluster toolsystem, in accordance with implementations of the disclosure.

FIG. 9 conceptually illustrates a configuration of load locks withintegrated post-processing modules, in accordance with implementationsof the disclosure.

FIG. 10 shows a control module for controlling the systems of thepresent disclosure.

DESCRIPTION

Implementations of the disclosure provide methods, apparatus, andsystems relating to a cluster tool architecture that achieves a compactfootprint with SEMI-compliant access space in the form of a servicetunnel defined below a wafer transport assembly. The wafer transportassembly further may include several buffers which are maintained in thesame controlled environment (e.g. a vacuum condition) as the rest of thewafer transport assembly, and which provide great flexibility forconfiguring wafer movement through the wafer transport assembly. Itshould be appreciated that the present embodiments can be implemented innumerous ways, such as a process, an apparatus, a system, a device, amaterial, or a method. Several embodiments are described below.

FIG. 1A conceptually illustrates a cross-section of a portion of acluster tool for processing wafers, in accordance with implementationsof the disclosure. In the illustrated implementation, a fabricationfacility floor 116 is shown, upon which equipment may be positioned. Thefabrication facility floor 116 is defined as an elevated floor that issupported over an underlying subfloor 120. The fabrication facilityfloor 116 can be defined by a series of tiles, which may be perforatedto permit airflow through the tiles to remove particulates from the fabenvironment. The tiles are supported by stanchions 118 above thesubfloor 120. In some implementations, the distance between thefabrication facility floor and the subfloor 120 is approximately 2 feet(approximately 60 centimeters). In some implementations, the distancebetween the fabrication facility floor and the subfloor 120 is in therange of approximately 1.5 to 2.5 feet (approximately 45 to 75centimeters). In some implementations, the distance between thefabrication facility floor 116 and the subfloor 120 is in the range ofapproximately 1 to 4 feet (approximately 0.3 to 1.2 meters).

In some implementations, the subfloor 120 is defined by a concretewaffle slab. The subfloor space 121 that is defined between thefabrication facility floor 116 and the subfloor 120 can be utilized forpassage of various facilities lines, such as process gas lines, vacuumlines, electrical/RF lines/feeds, data cables, liquid supply lines, etc.It will be appreciated that passage of such lines can be along thesubfloor 120 and may also extend through the subfloor 120 to the floorbelow, permitting connection to supporting equipment located on thefloor below.

Process modules 100 and 106 are positioned at an elevated height abovethe fabrication facility floor 116. More specifically, in theillustrated implementation, the process modules 100 and 106 aresupported by process module frames 108 and 110, respectively. Eachprocess module frame is configured to elevate its respective processmodule and thereby provide an underlying space below the process moduleto accommodate various facilities and equipment which are required foroperation of the process module. By situating facilities below theprocess module, the horizontal space required for operation isconserved, which permits process modules to be placed closer to eachother within a given cluster tool system, and thereby also permitsadjacent cluster tool systems to be placed closer to each other.

In some implementations, the space below the process module that isdefined by the process module frame is configured to have a minimumheight so as to accommodate an RF feed having a predefined verticallength that extends downward from the process module. The RF feedstructure may be connected to a chuck that is configured to be moved upand down within the chamber of the process module, thereby also movingthe RF feed structure up and down, and so the process module frame isconfigured to provide ample height to accommodate such verticalmovements.

As process modules and cluster tool systems are more tightly packedtogether, access space becomes more limited relative to the number ofequipment pieces and cluster tool systems in a given area of thefabrication facility. This can be problematic as limited access toequipment makes service or repair operations more difficult to perform,and may require additional steps to gain the necessary access to theequipment, such as disassembling or moving portions of or entire piecesof equipment. Such additional steps will increase downtime and thereforereduce some of the yield benefit that would otherwise be achievedthrough a compact footprint architecture.

To address these issues, in accordance with implementations of thedisclosure, a service tunnel 124 is provided in a space below the wafertransport modules (including wafer transport module 102) of the clustertool. The service tunnel 124 is further defined by a service floor 122below the wafer transport module 102. The service floor 122 is a droppedfloor relative to the fabrication facility floor 116, and is defined ata height below that of the fabrication facility floor but above thesubfloor 120. The service floor 122 thus leverages the subfloor spacethat would otherwise exist between the fabrication facility floor 116and the subfloor 120, and utilizes this space to provide additionalheight for the service tunnel 124. The service tunnel 124 is thusdefined between the wafer transport module 102 and the service floor122, and has a height H₁ that is sufficient for an average size human(approximately 5 to 6 feet (approximately 150 to 180 cm) tall) to standup. In some implementations, the height H₁ is in the range ofapproximately 2 to 8 feet (approximately 0.6 to 2.4 meters). In someimplementations, the height H₁ is in the range of approximately 5.5 to7.5 feet (approximately 1.7 to 2.3 meters). In some implementations, theheight H₁ is approximately 7 feet (approximately 2.1 meters).

It should be appreciated that the service tunnel 124 and cluster toolarchitecture as defined in accordance with implementations of thepresent disclosure are compliant with SEMI (Semiconductor Equipment andMaterials International) E72 standards governing space requirements forsemiconductor manufacturing equipment.

In the illustrated implementation, a robot actuator 104 which is part ofthe wafer transport module 102 is shown for completeness of thedisclosure. The robot actuator 104 as shown is contemplated as being anapproximately cylindrical structure extending downward from the mainbody of the wafer transport module 102. Adjacent to the robot actuator104 (fore, aft, and lateral to the robot actuator), the height of theservice tunnel space extends from the service floor 122 to the bottom ofthe wafer transport module 102 providing the height H₁ which issufficient for an average size human to stand without impediment.

The service tunnel 124 is defined between the process modules 100 and106, and also between the process module frames 108 and 110. In someimplementations, gas boxes 112 and 114, which service process modules100 and 106, respectively, are positioned along the sides of the servicetunnel 124. The service tunnel 124 may therefore have a width W₁. Inaccordance with some implementations, the width W₁ is in the range ofapproximately 2 to 6 feet (approximately 0.6 to 1.8 meters). In someimplementations, the width W₁ is in the range of approximately 2.5 to 4feet (approximately 0.7 to 1.3 meters). In some implementations, thewidth W₁ is in the range of approximately 3 to 3.5 feet (approximately0.9 to 1.1 meters). The interior facing portions of the process moduleframes define sidewalls for the service tunnel.

The service tunnel 124 provides access to the equipment of the clustertool system from the interior region of the cluster tool system. Thisaccess is important as the process modules and other equipment of thecluster tool system are positioned very close to each other to reducethe footprint of the system. More specifically, the service tunnel 124provides access to the underside of the wafer transport module 102, andto interior-facing sides of the process modules 100 and 106. The gasboxes 112 and 114 provide access to gas lines which service the processmodules 100 and 106, respectively. Gas boxes 112 and 114 are definedalong the sidewalls of the service tunnel and are also accessible fromthe service tunnel 124.

The interior height H₁ of the service tunnel is defined by the verticaldimensions of various components of the system, including the depth D₁of the service floor 122 below the level of the fabrication facilityfloor 116, as well as the height H₂ at which the process module frames108 and 110 are configured to raise the process modules 100 and 106. Theavailable depth for the service floor is dependent upon the elevation ofthe fab floor above the subfloor, i.e. the height H₁. Thus, in variousimplementations, the depth D₁ of the service floor may range from 0 tothe value of H₁. In some implementations, the depth D₁ ranges fromapproximately 0 to 4 feet (approximately 0 to 60 cm). In someimplementations, the depth D₁ ranges from approximately 1 to 2 feet(approximately 30 to 60 cm). In some implementations, the depth D₁ranges from approximately 1.5 to 1.8 feet (approximately 45 to 55 cm).

In some implementations, the height H₂ of the process module frames isin the range of approximately 2 to 6 feet (approximately 0.6 to 1.8meters). In some implementations, the height H₂ is in the range ofapproximately 3 to 6 feet (approximately 0.9 to 1.8 meters). In someimplementations the height H₂ is in the range of approximately 2.5 to4.5 feet (approximately 0.8 to 1.4 meters). The service tunnel 124 insome implementations is defined beneath a wafer transport assembly thatis defined by one or more wafer transport modules, such as wafertransport module 102. In some implementations, the service tunnelextends lengthwise from a front end defined at an equipment front endmodule (EFEM) to a back end defined by a back side of a rear-most wafertransport module. The service floor 122 of the service tunnel 124 can beconceptually understood as defining a pit located below the wafertransport assembly, to provide for an adequate vertical height to allowpersonnel to stand unimpeded in the pit.

Entry into the service tunnel 124 is provided from the rear end of theservice tunnel which opens to the fabrication facility floor. To providefor ingress and egress from the service tunnel 124, a ladder or a set ofsteps/stairs can be positioned at the rear end of the service tunnel124, which define a pathway from the service floor 122 up to thefabrication facility floor 116. In some implementations, a foldable stepladder can be provided that defines the steps when unfolded, but canalso be folded up when not in use. In this manner, the steps forentry/exit are provided when needed, but can be stowed when not neededand therefore do not occupy service floor space for purposes of meetingstandardized service floor space requirements. In some implementations,when folded up, the step ladder may be configured to block the entryinto the service tunnel, enhancing the safety of the system andpreventing persons from accidentally falling into the service tunnel.

FIG. 1B illustrates a perspective view of a cluster tool system, inaccordance with implementations of the disclosure. In the illustratedimplementation, the rear end opening of the service tunnel 124 isvisible. As shown, the service tunnel 124 is defined underneath thewafer transport assembly 209, extending from a front end of the wafertransport assembly 209 that is oriented towards the EFEM 200, to a rearend of the wafer transport assembly 209 opposite the front end.

FIG. 10 illustrates a perspective view of a cluster tool system, inaccordance with implementations of the disclosure. In the illustratedimplementation, a fab level and a sub-fab level are shown, withsupporting equipment for operation of the process modules beingpositioned at the sub-fab level. The front end 128 of the service tunnel124 is visible in the illustrated implementation. As shown in accordancewith implementations of the disclosure, the front end 128 of the servicetunnel 124 may extend to the EFEM 200.

FIG. 1D illustrates a cross-section view of a cluster tool system, inaccordance with implementations of the disclosure. The illustratedimplementation again shows the relationship between the fab level andthe sub-fab level. The illustrated persons are shown approximately toscale, providing an indication of the available space in the servicetunnel 124 for persons to maneuver.

FIG. 1E conceptually illustrates a cross-section of a portion of acluster tool for processing wafers, in accordance with implementationsof the disclosure. In the implementation of FIG. 1E, the floor of theservice tunnel 124 is defined at the level of the fab floor 116. In someimplementations, the floor of the service tunnel 124 can be defined bythe fab floor 116. Whereas in other implementations, the floor of theservice tunnel 124, while being defined at the level of the fab floor116, may have a different structure than that of the surrounding fabfloor 116. It will be appreciated that the height H₂ of the processmodule frames 108 and 110 will be higher as compared to theimplementation of FIG. 1A. In implementations as shown with continuedreference to FIG. 1E, wherein the floor of the service tunnel 124 isdefined at the level of the fab floor 116, the height H₂ of the processmodule frames typically ranges from about 2 to 6 feet (approximately 0.6to 1.8 meters). In some implementations, the height H₂ ranges from about4.5 to 6.5 feet (approximately 1.4 to 2 meters). In someimplementations, the height H₂ ranges from about 4 to 7 feet(approximately 1.2 to 2.1 meters).

FIG. 1F illustrates a cut-away view (vertical cut-away along alongitudinal front-to-rear axis) of a cluster tool for processingwafers, in accordance with implementations of the disclosure. Theinterior of the service tunnel 124 is thus shown in the illustratedfigure. The gas boxes 114, 134, and 136 provide access to gas lineswhich feed to the process modules 106, 214, and 220, respectively. Thegas boxes are positioned over a scrubbed exhaust duct 132 which exhaustsair from the fab. In the illustrated implementation, a side cover of theexhaust duct 132 is removed. The gas boxes include perforations 137 toallow air from the fab to flow through them and into the exhaust duct132. The dashed arrows in the diagram illustrate the direction ofairflow through the gas boxes and into the exhaust duct, for eventualrouting and removal through the subfloor of the fab.

Additionally, in some implementations, gas lines 138 are positionedinside of the exhaust duct 132. By running the gas lines through theexhaust duct, space is conserved in the fab, allowing the exhaust ductto serve an additional function. Furthermore, by positioning the gaslines in the exhaust duct, the potential for contamination in the fabdue to gas line leaks is minimized, as any leaked gaseous species areimmediately exhausted via the exhaust duct. Because the risk ofcontamination is minimized, then it may be possible to use lower gradegas line material (than would otherwise be utilized for gas linespositioned outside of the exhaust duct), thereby reducing cost.

FIG. 2 illustrates an overhead view of a cluster tool system,illustrating conceptual cutaways of various equipment pieces of thesystem, in accordance with implementations of the disclosure. The frontof the cluster tool system is defined by an equipment front end module(EFEM) 200 which includes a plurality of load ports 202 a, 202 b, 202 c,and 202 d for receiving a plurality of wafer transport containers 204 a,204 b, 204 c, and 204 d, respectively. In some implementations, thewafer transport containers are front opening unified pods (FOUP's). TheEFEM 200 may further include buffer stations 206 a, 206 b, and 206 c.The EFEM 200 and its buffer stations 206 a, 206 b, and 206 c, can beoperated under controlled ambient conditions or under atmosphericconditions.

Connected to the rear of the EFEM 200 is a load lock 208 that defines apassageway into a wafer transport assembly 209. The wafer transportassembly is defined by a plurality of wafer transport modules 102, 212,and 218, which are connected in series, and extend back from the loadlock 208. Each of the wafer transport modules controls entry into, andexit from, adjoining process modules. For example, the wafer transportmodule 102 is configured to move wafers into or out of adjoining processmodules 100 and 106. Wafer transport module 212 is configured to movewafers into or out of adjoining process modules 210 and 214. Wafertransport module 218 is configured to move wafers into or out of theadjoining process modules 216 and 220.

Each of the wafer transport modules includes a robot (robotic waferhandler) configured to engage and pick up wafers and transport them. Inthe illustrated implementation, wafer transport modules 102, 212, and218, include robots 222, 224, and 226, respectively. The robots may haveend effectors which are configured for engaging with wafers. Thus therobots of the wafer transport modules are configured to move the waferswithin the wafer transport assembly 209, and further to move the wafersinto or out of adjoining process modules.

In the illustrated implementation, the wafer transport assembly 209 isdefined by the wafer transport modules 102, 212, and 218. The wafertransport assembly 209 extends from the load lock 208 rearward to theback side of the rear-most wafer transport module 218. As notedpreviously, the service tunnel 124 is defined underneath the wafertransport assembly 209. In some implementations, the service tunnel 124extends from the front end of the wafer transport assembly 209 (definedby the front end of the wafer transport module 102) to the back end ofthe wafer transport assembly 209 (defined by the back end of the wafertransport module 218). In some implementations, the service tunnel 124extends at its front end to the EFEM 200. The service tunnel 124provides access to the undersides of the wafer transport modules 102,212, and 218, to for example, service the robots 222, 224, and 226 ofthe wafer transport modules.

The wafer transport assembly 209 further includes gate valves whichcontrol an opening between a given wafer transport module and anadjacent process module. In the illustrated implementation, the gatevalve 228 controls an opening between the wafer transport module 102 andthe process module 100; the gate valve 230 controls an opening betweenthe wafer transport module 102 and the process module 106; the gatevalve 232 controls an opening between the wafer transport module 212 andthe process module 210; the gate valve 234 controls an opening betweenthe wafer transport module 212 and the process module 214; the gatevalve 236 controls an opening between the wafer transport module 218 andthe process module 216; the gate valve 238 controls an opening betweenthe wafer transport module 218 and the process module 220.

A given gate valve can be opened to allow a wafer to be transported intoor out of an adjacent process module by the corresponding wafertransport module. The gate valve may be closed to isolate the adjacentprocess module, for example, for processing of a wafer that has beenplaced into the process module or for performance of any other operationrequiring isolation of the process module from the wafer transportmodule. In some implementations, the gate valves 228, 230, 232, 234,236, and 238 are integrated into the wafer transport assembly 209. Byintegrating the gate valves into the wafer transport assembly 209, theoverall footprint of the wafer transport assembly is reduced (ascompared to a wafer transport assembly having non-integrated gatevalves). The interior environment of the wafer transport assembly 209 iscontrolled, and can be defined as a vacuum environment or a controlledambient environment. In some implementations, the wafer transportassembly 209 is filled with an inert gas. In various implementations,the wafer transport assembly 209 is operated under pressure conditionsranging from atmosphere to vacuum conditions. In accordance with someimplementations of the disclosure, vacuum conditions can be defined byan internal pressure that is less than about 760 Torr. In accordancewith some implementations of the disclosure, vacuum conditions can bedefined by an internal pressure that is less than about 10 Torr. In someimplementations, a vacuum condition is defined by an internal pressureranging from about 1×10{circumflex over ( )}−9 Torr to about 1 Torr.

With continued reference to FIG. 2, in accordance with implementationsof the disclosure, a plurality of buffer stacks are defined in the wafertransport assembly 209. Buffer stacks 240 and 242 are defined betweenthe wafer transport modules 102 and 212. Buffer stacks 244 and 246 aredefined between the wafer transport modules 212 and 218. Buffer stacks248 and 250 are defined at the back side of the wafer transport module218. It should be appreciated that the buffer stacks are defined withinthe wafer transport assembly 209, and as such, the buffer stacks sharethe same controlled environment as that of the wafer transport assembly.This provides an advantage over conventional systems in that wafers donot need to exit the controlled environment of the wafer transportassembly 209 to be stored. As wafers can be buffered in the wafertransport assembly 209, they are thus immediately accessible by wafertransport modules to be transported to a process module or elsewhere.

In some implementations, a given buffer stack is configured to have acapacity to store approximately 2 to 20 wafers. In some implementations,a given buffer stack is configured to have a capacity to storeapproximately 5 to 15 wafers. In some implementations, a given bufferstack may have a capacity to store approximately 5 to 10 wafers. In someimplementations, a given buffer stack may have a capacity to storeapproximately 8 wafers. Each buffer stack defines a plurality of storageslots that are defined in a vertically stacked arrangement. The storageslots can have separators or partitions defined between them, whichisolate a given wafer in the wafer stack from other wafers.

As noted, the buffer stacks are positioned between adjacent wafertransport modules. Additionally, the buffer stacks are positioned alongthe lateral sides of the wafer transport assembly, which achieves acompact footprint of the wafer transport assembly, as the buffer stacksare positioned to leverage the space that exists between adjacent wafertransport modules and adjacent process modules which are connected tothe wafer transport modules. More specifically, the central axes of thebuffer stacks are laterally offset from a medial plane defined by thecentral rotational axes of the robots of the wafer transport modules.The central axis of a given buffer stack is defined as a vertical axisextending through the centers of wafers when they are stored in thebuffer stack. And the central rotational axes of the robots are alignedwith each other in a front-to-rear arrangement that defines the medialplane. A single directional axis 270 can be defined along this medialplane, extending rearward from the EFEM 200. As discussed further below,buffer modules which define the buffer stacks can be provided. The wafertransport modules and buffer modules are aligned in the singledirectional axis 270.

With continued reference to FIG. 2, the buffer stack 242 is defined in alocation nested between the wafer transport modules 102 and 212, and theprocess modules 106 and 214. The lateral side protrusion 252 of thewafer transport assembly 209, which accommodates and defines thelocation of the buffer stack 242, extends laterally beyond the lateralside portions 252 and 254 that interface with the adjacent processmodules 214 and 106, respectively. Additional lateral side protrusionsof the wafer transport assembly accommodating and define locations ofthe additional buffer stacks and are similarly configured relative totheir corresponding process modules. For example, the lateral sideprotrusion 262 is nested between the wafer transport modules 212 and218, and the process modules 214 and 220. The lateral side protrusion262 is configured to define the location of the buffer stack 246.

In some implementations, the wafer transport assembly is configured sothat the outer edges of wafers, when positioned on a buffer stack,extend laterally at least to a plane defined by the opening of anadjacent gate valve. In some implementations, the outer edges of wafers,when positioned on the buffer stack, extend laterally beyond such aplane. The further the buffer stacks are laterally positioned, thecloser the adjacent wafer transport modules can be positioned to eachother; however, the wider the wafer transport assembly 209 will become.

In terms of the architectural concept of the wafer transport assembly,the locations of the buffer stacks are positioned laterally outward,which allows the wafer transport modules to be more closely placed toeach other. This reduces the overall length of the wafer transportassembly from front to rear. In some implementations, the front-to-rearlength of the wafer transport assembly is approximately 10 to 11 feet(approximately 3 to 3.3 meters) for a wafer transport assembly havingthree wafer transport modules and four buffer stacks (without theoptional buffer stacks 248 and 250). In some implementations, thefront-to-rear length of the wafer transport assembly is approximately 6to 8 feet (approximately 1.8 2.4 meters) for a wafer transport assemblyhaving two wafer transport modules and two or four buffer stacks.

In view of the placement of the buffer stacks and more specifically, theprotrusion of the lateral side portions of the wafer transport assemblythat accommodate the buffer stacks, the corner regions of the processmodules that are nearest to the buffer stacks are cut off or roundedoff. By way of example with continued reference to FIG. 2, the cornerregion 258 of process module 106 is cut off to accommodate theprotrusion of the lateral side portion 252 of the wafer transportassembly. Similarly, the corner region 260 of process module 214 is alsocut off to accommodate the protrusion of the lateral side portion 252.The additional process module corner regions nearest to the bufferstacks are similarly configured to accommodate the lateral protrusion ofthe lateral side portions of the wafer transport assembly which aredefined to accommodate the buffer stacks.

It should be appreciated that the cut off corner regions of the processmodules allow the process modules to be positioned closer to theirrespective wafer transport modules than would otherwise be possiblegiven the placement of the buffer stacks in the wafer transport assembly209. This reduces the lateral space requirement of the cluster toolsystem, thus providing for more efficient space utilization in thefabrication facility. Overall, the placement of the buffer stacks, theconfiguration of the lateral sides of the wafer transport assembly, andthe cut off configuration of the corner regions of the process modules,together provide a very compact cluster tool architecture that alsoaffords great flexibility in terms of wafer handling, storage, andtransport within a controlled environment.

FIG. 3A is a perspective view of a wafer transport assembly, inaccordance with implementations of the disclosure. In the illustratedimplementation, the wafer transport assembly 209 is composed of twosections, which are assembled to each other to define the wafertransport assembly 209 as shown. A first section of the wafer transportassembly 209 is defined to include the wafer transport modules 102 and212, as well as the buffer stacks 240 and 242 which are defined betweenthe wafer transport modules 102 and 212. The first section can bemodularly assembled from the wafer transport modules 102 and 212 inconjunction with a buffer module (positioned between the wafer transportmodules) that defines the buffer stacks 240 and 242. It will beappreciated that the wafer transport modules and the buffer module arealigned in the single directional axis 270. A second section of thewafer transport assembly 209 is defined to include the wafer transportmodule 218 as well as the buffer stacks 244 and 246, which are definedbetween the wafer transport modules 212 and 218. A second buffer modulecan be configured to define the buffer stacks 244 and 246, with thewafer transport modules 218 and the second buffer module being alignedin the single directional axis 270. Though not shown in FIG. 3A, anoptional third section can be attached to the rear end of the secondsection, the third section being a (third) buffer module that definesthe buffer stacks 248 and 250, and which is also aligned in the singledirectional axis 270.

The modular configuration thus shown and described allows for the wafertransport assembly to be configured to have two or three wafer transportmodules, and have one, two, or three pairs of buffer stacks. In a baseconfiguration, the wafer transport assembly can be defined to includeonly the first section, and therefore will have two wafer transportmodules and two buffer stacks. In some implementations, the baseconfiguration is designed to fit within a SEMI E72 compliant elevator,thereby facilitating move-in to a fabrication facility. In anotherconfiguration, a buffer module can be added to the base configuration toadd two additional buffer stacks (total of four buffer stacks). Inanother configuration, the aforementioned second section can be joinedto the first section to define a wafer transport assembly as shown inFIG. 3A, having three wafer transport modules and four buffer stacks. Inyet another configuration, a buffer module can then be added to providefor a wafer transport assembly having three wafer transport modules andsix buffer stacks.

In the illustrated implementation, a first cover plate 300 defines thetop of the first section of the wafer transport assembly 209. The firstcover plate 300 includes window portals 302 and 304 which allow forvisual inspection of the interior of the wafer transport assembly, andwhich may be opened to provide access to the interior. A second coverplate 306 defines the top of the second section of the wafer transportassembly 209. The second cover plate 306 also includes a window portal308, which similarly allows for visual inspection of the interior andmay be opened to provide access thereto.

The wafer transport assembly 209 has thus been described as composed ofseveral modular components. The modular assembly of the wafer transportassembly provides for ease of configuration to suit particular clustertool setups, and also facilitates repair and/or replacement ofindividual modules. Also, the assembly/disassembly of the modulesfacilitates move-in or move-out from a given fabrication facilitylocation. It will be appreciated that when fully assembled, the variousmodules of the wafer transport assembly 209 together define an outerhousing, the housing defining an interior region that is continuous andmaintained as a controlled environment. The housing contains the variouscomponentry of the wafer transport assembly 209, including the robotsand the buffer stacks.

Positioned at the front end of the wafer transport assembly 209 is aload lock module 208. The load lock module 208 controls entry into andout of the wafer transport assembly 209, facilitating transfers ofwafers between the lab ambient condition of the EFEM and the vacuum orcontrolled ambient condition of the wafer transport assembly 209. Insome implementations, the load lock module 208 is a double unit—that is,load lock module 208 includes two separate load lock slots that areindependently controlled to allow two individual wafers to besimultaneously loaded and/or unloaded from the wafer transport assembly209. The time required to evacuate a load lock slot (e.g. when a waferis moving from the ambient condition of the EFEM into the vacuumcondition of the wafer transport assembly) and/or fill a load lock slot(e.g. when a wafer is moving from the vacuum condition of the wafertransport assembly to the ambient condition of the EFEM) is timeconsuming and can become a limiting factor in the ability of the clustertool system to process wafers. Therefore, it is desirable to provide formore than one load lock slot to allow multiple wafers to enter and/orexit the wafer transport assembly 209 simultaneously.

FIG. 3B illustrates a perspective view of the wafer transport assemblyof FIG. 3A, without the cover plates installed, so as to provide a viewof the interior of the wafer transport assembly, in accordance withimplementations of the disclosure. As can be seen, the first section 310of the wafer transport assembly 209 includes the buffer stacks 240 and242, as well as robot 224 (robot 102 is not visible in FIG. 3B). Therobot 224 includes an end effector 314 that is configured to engage andsupport a wafer for handling by the robot. The second section 312 of thewafer transport assembly is shown including the buffer stack 244 (bufferstack 246 not visible in FIG. 3B) and an end effector 316 of the robot226.

FIG. 4A illustrates a perspective view of a wafer transport module, inaccordance with implementations of the disclosure. For ease ofdescription and contextual understanding of the wafer transportassembly, the wafer transport module 102 is described. However, itshould be appreciated that the description may also apply to wafertransport modules 212 and 218 of the wafer transport assembly 209. Thewafer transport assembly 209 can be defined from modular components thatcan be assembled or disassembled to provide for ease of configuration aswell as facilitating repair and replacement of individual componentswhen necessary. In the illustrated implementation, a view of theinterior of the wafer transport module 102 is provided, wherein therobot 222 is shown including an end effector 400 that is configured toengage with and support wafers being handled by the robot 222.

Also visible is the gate valve 230 that controls an opening into processmodule 106. The gate valve 230 can be opened for transfer of a waferbetween the wafer transport module 102 and the process module 106 (e.g.for loading or unloading of a wafer from the process module), or thegate valve 230 can be closed to isolate the process module 106 from thewafer transport module 102 (e.g. during processing of a wafer). The gatevalve 230 is defined along a lateral side 402 of the wafer transportmodule 102. The lateral side 402 of the wafer transport module 102 isconfigured for connection to the process module 106. The lateral side402 of the wafer transport module 102 may further include a sealmechanism 404 that is configured to form an airtight seal when theprocess module 106 is attached to the wafer transport module 102. By wayof example without limitation, the seal mechanism 404 may be defined bya gasket, a corresponding groove and slot, and/or any other type ofmechanism that may achieve an airtight seal when the process module 106is connected to the wafer transport module 102.

With continued reference to FIG. 4A, a back side 406 (facing away fromthe EFEM 200) of the wafer transport module 102 is also shown, the backside 406 being configured for connection to a buffer module 410(illustrated at FIG. 4B). The back side 406 of the wafer transportmodule 102 may also include a seal mechanism 408 that is configured toprovide an airtight seal when the buffer module 410 is attached to thewafer transport module 102.

In some implementations, such as for the wafer transport modules 212 or218, instead of a buffer module, a back cover plate may be attached tothe back side of the wafer transport module, thus defining the back sideof the wafer transport assembly in such implementations. The modularcomponents thus described provide for a system architecture ofalternating wafer transport modules and buffer modules, which can beserially assembled or disassembled to define a desired configuration fora wafer transport assembly.

FIG. 4B illustrates a perspective view of the wafer transport module 102with a buffer module 410 attached thereto, in accordance withimplementations of the disclosure. A front side of the buffer module 410(not visible in FIG. 4B) connects to the back side 406 of the wafertransport module 102, forming an airtight seal between the modules. Theback side 412 of the buffer module 410 is further configured forattachment to either another wafer transport module or a back coverplate. The back side 412 of the buffer module 410 may include a sealmechanism 414 configured to form an airtight seal with the adjoiningwafer transport module or back cover plate.

The buffer module 410 defines the buffer stacks 240 and 242, which areconfigured to store a plurality of wafers. Lateral ends of the buffermodule define the aforementioned side protrusions of the wafer transportassembly. The buffer stacks share the same controlled environment thatis defined for the wafer transport modules. This provides advantages inthat wafers can be buffered within the system's controlled environmentwithout requiring transfers outside of the system. This helps to limitexposure to possible contaminants and also avoids cycling of the wafersthrough different environments. For example, a wafer that has beenprocessed under a vacuum condition and that is then subjected to anambient condition might react with the ambient gases or otherwise beexposed to contaminants or particulates. Hence, the placement of bufferstacks within the controlled environment of the wafer transport systemprovides wafer storage sites to avoid such potential adverse effects.

Each of the buffer stacks defines a plurality of wafer storage slots,with each wafer storage slot being configured to store a single wafer(e.g. wafer 420). In the illustrated implementation, the wafer storageslots of the buffer stacks 240 are defined by support arms 416 that areconfigured for supporting a wafer in the buffer stack. Additionally,there may be separators defined that separate wafer storage slots fromeach other. It should be appreciated that in various implementations thenumber and arrangement of both the separators and wafer storage slots(as defined by the support arms) can vary. In the illustratedimplementation, buffer stacks 240 is shown having separators 418 a, 418b, and 418 c, which separate four pairs of wafer storage slots. Thebuffer stack 240 as shown thus includes eight wafer storage slots intotal. Buffer stack 242 is similarly configured to have eight waferstorage slots, with four pairs of wafer storage slots being separated bythree separators.

FIG. 5 conceptually illustrates a cross section view of a buffer stack500, in accordance with implementations of the disclosure. The bufferstack 500 includes an upper section 502 having wafer storage slots thatare separated from each other by physical partitions, and a lowersection 504 having wafer storage slots that are not separated from eachother by physical partitions. A given wafer storage slot is defined by aset of support arms 508 that are configured to support a wafer (e.g.wafer 510) when stored in the given wafer storage slot. The waferstorage slots of the upper section 502 are separated from each other byseparators 506 a, 506 b, and 506 c, and the upper section 502 isseparated from the lower section 504 by a separator 506 d. Theseparators define physical partitions between adjacent wafer storageslots.

In some implementations, the wafer storage slots of the upper section502 can be utilized to store wafers that may be more sensitive orsusceptible to contamination, whereas the wafer storage slots of thelower section 504 may be utilized to store wafers that are lesssensitive or susceptible to contamination. In some implementations, thelower section 504 may be utilized to store wafers that are reused in thecluster tool system, such as cover wafers or seasoning wafers.

Cover wafers are used to cover the chuck of a process module during achamber maintenance operation (e.g. in-situ clean). In conventionalsystems, cover wafers are typically stored outside of the wafertransport assembly under lab ambient conditions. This requires a givencover wafer to enter the wafer transport assembly through an airlockeach time the cover wafer is to be used, which can be a source ofunwanted particles in the system. This may be especially problematicwhen cover wafers are used frequently (e.g. used every lot). As thecover wafers are utilized, they are etched, and repeatedly transportingthem in and out of the wafer transport assembly through the load lock isa particle source that may ultimately reduce yield or necessitate morefrequent maintenance/cleaning. Thus, it is advantageous to store coverwafers in the wafer transport assembly (e.g. under vacuum condition) andso not subject the cover wafers to pressure cycles resulting from movingthem in and out of the wafer transport assembly, as this will reduce theamount of contaminants entering the system.

Furthermore, in some implementations, the chemistry for chamber cleaningmay be corrosive upon exposure to atmosphere/moisture. For example, whenchlorine-based chemistry is applied, a cover wafer kept in vacuum mighthave fairly non-volatile chlorides on the surface of the cover wafer.But if the cover wafer is transported out of the wafer transportassembly into atmosphere, then the chlorides may react with moisture inthe air, and may outgas and cause corrosion. Thus, by storing the coverwafers in vacuum in a buffer stack as described, then this issue isavoided, and the service life of the cover wafers may be extended.

It should be appreciated that the above discussion concerning coverwafers and particle generation/corrosion also applies to seasoningwafers which are utilized to burn in a chamber. In the illustratedimplementation of FIG. 5, a lower section of the buffer stack that doesnot have physical partitions separating the wafer storage slots may bereserved and/or utilized for storage of cover wafers or seasoningwafers, while an upper section of the buffer stack (which may havephysical partitions separating individual wafer storage slots) isreserved and/or utilized to store wafers undergoing process operationsin the cluster tool system. However, it will be appreciated that inother implementations, cover or seasoning wafers may be stored in anygiven wafer storage slot (or section of wafer storage slots) in a bufferstack having any particular configuration of wafer storage slots andseparators.

In some implementations, an entire buffer stack may be reserved and/orutilized for storage of cover/seasoning wafers. For example, withreference to the implementation of FIG. 2, buffer stack 248 and/orbuffer stack 250 could be configured for storage of cover/seasoningwafers, providing dedicated buffer stack(s) for this purpose.

FIG. 6 illustrates a cross section view of a portion of a buffer module,showing a buffer stack, in accordance with implementations of thedisclosure. The buffer stack 600 is similar to the embodiment of FIG. 5,including an upper section 602 having wafer storage slots 610 a, 610 b,610 c, and 610 d, and a lower section 604 having wafer storage slots 612a, 612 b, and 612 c. The wafer storage slots 610 a-d are individuallypartitioned by separators 606 a, 606 b, 606 c, and 606 d, whereas thewafer storage slots 612 a-c are not individually partitioned by physicalseparators. In some implementations, the wafer storage slots 612 a-c ofthe lower section 604 are reserved and/or utilized for storage of coverwafers, seasoning wafers, or any other type of wafer that is reused inthe process modules.

The buffer stack 600 further includes a wafer storage slot 615positioned below the lower section 604, and partitioned therefrom by aseparator 614. The wafer storage slot 615 includes a wafer orienter 616that is capable of supporting and rotating a wafer placed thereon. Itwill be appreciated that as a given wafer is transported throughout awafer transport assembly in accordance with embodiments of thedisclosure, the rotational orientation of the wafer will change. Forsome process modules it may be desirable to place the wafer into theprocess module in a specific rotational orientation. Therefore, it isuseful to have a wafer orienter integrated into the buffer stack torotate a given wafer so that it will have the specific rotationalorientation that is desired for the process module. In someimplementations, the wafer orienter 616 further includes an actuator 618that extends below the main housing of the buffer module 410. Theactuator 618 is configured to drive the rotation of the wafer orienter616.

FIG. 7 illustrates a cluster tool system, highlighting the orientationof a wafer as it is moved through various components of the system, inaccordance with implementations of the disclosure. The illustratedsystem is similar to the implementation of FIG. 2, including wafertransport modules 102, 212, and 218, as well as buffer stacks 240, 242,244, and 246, collectively defining a wafer transport assembly.

In the illustrated implementation, the buffer stacks are canted by 33degrees. That is, the center of each buffer stack deviates by 33 degreesfrom a vector defined from the center of an adjacent wafer transportmodule to the center of another adjacent wafer transport module. Forexample, if a vector is defined from the center of wafer transportmodule 102 to the center of wafer transport module 212, then the centersof buffer stacks 240 and 242 each deviate by 33 degrees from such a thevector. Because the buffer stacks are canted, in the absence of anyactive rotation of a given wafer within the system, the wafer'srotational orientation will change as it is moved through the bufferstacks and may be different from one process module to the next.

With continued reference to FIG. 7, additionally shown is a wafer 700having a notch whose location is conceptually shown by the dot indicatedat reference 702. By way of example, in the illustrated implementation,the wafer 700 is shown entering the wafer transport assembly through theairlock 208, the wafer 700 at this stage having its notch aligned in thelongitudinal direction oriented towards the rear of the wafer transportassembly. From this location, when the wafer 700 is moved by the wafertransport module 102 into the process module 106, then the wafer rotates90 degrees counterclockwise, such that the notch becomes oriented in thelateral direction towards the opening of the process module 106. In someimplementations, this is the desired orientation for the wafer when inthe process module 106, and thus no additional rotation of the wafer orreconfiguration of the process module is required. Following processingin the process module 106, the wafer 700 may be moved by the wafertransport module 102 to the buffer stack 242, which causes the wafer torotate an additional 57 degrees counterclockwise. It will be appreciatedthat the notch is oriented towards the center of the wafer transportmodule 102 when it is being handled by the wafer transport module 102and moved between any of the load lock 208, the process module 100 or106, and the buffer stacks 240 or 242.

From the buffer stack 242, if the wafer 700 is moved by the wafertransport module 212 to the process module 214, then the wafer 700rotates counterclockwise by an additional 57 degrees. This means thatthe notch deviates by 114 degrees counterclockwise from a vector definedfrom the center of the wafer 700 to the center of the wafer transportmodule 212. As the desired orientation of the wafer 700 for the processmodule 214 may be no deviation from the vector as defined, then rotationof the wafer 700 prior to entering the process module 214 may bedesirable. For example, a wafer orienter integrated into the bufferstack 242 may be configured to rotate the wafer 700 by 114 degrees in aclockwise direction, so as to provide for the wafer 700 to be aligned inthe desired orientation when transported into the process module 214.

In a similar fashion, if from the buffer stack 242 the wafer 700 asshown is moved into the process module 210, then the wafer 700 rotatesclockwise by 123 degrees. This may again result in the wafer orientationdeviating by 114 degrees counterclockwise from the desired orientationfor the process module 210. Similarly, a wafer orienter integrated intothe buffer stack 242 may be configured to rotate the wafer 700 by 114degrees in a clockwise direction, so as to provide for the wafer 700 tobe aligned in the desired orientation (the notch oriented towards thecenter of the wafer transport module 212) when transported into theprocess module 210.

From the process module 214, if the wafer 700 as shown is then moved bythe wafer transport module 212 to the buffer stack 246, then the wafer700 is rotated clockwise by 57 degrees. It will be appreciated that ifthe wafer 700 as shown is moved by the wafer transport module 212, fromeither of the buffer stack 242 or the process module 210, to the bufferstack 246, then the wafer 700 will achieve the same orientation. If thewafer 700 is then moved by the wafer transport module 218 from thebuffer stack 246 to the process module 220, then the wafer 700 will berotated by an additional 57 degrees, meaning that the orientation of thenotch will deviate by 132 degrees clockwise from a vector defined fromthe center of the wafer 700 to the center of the wafer transport module218. If the wafer 700 is moved by the wafer transport module 218 fromthe buffer stack 246 to the process module 216, then the wafer 700 willbe rotated by 123 degrees clockwise, again meaning that the orientationof the notch will deviate by 132 degrees clockwise from a vector definedfrom the center of the wafer 700 to the center of the wafer transportmodule 218. A wafer orienter may be included in the buffer stack 246 torotate wafers during processing as needed to ensure optimal rotationalorientation when transported into the process modules.

Though in the foregoing discussion, the buffer stacks are described asbeing canted by 33 degrees, it will be appreciated that in otherimplementations, the buffer stacks are canted by angles ranging fromabout 30 to 35 degrees. In still other implementations, the bufferstacks are canted by angles ranging from about 25 to 40 degrees. Theconcepts discussed above regarding the rotation of the wafer duringtransport in the system apply regardless of the specific angle by whichthe buffer stacks are canted, and the specific orientation of the waferat any given location in the system will be apparent to those skilled inthe art.

In implementations of the disclosure, the wafer transport assembly caninclude several buffer stacks that are configurable to be used forvarious purposes, and which aid in providing throughput advantages overprior art systems. The buffer stacks can be utilized to define pathwaysfor wafers. For example, in some implementations, at least some waferstorage slots in at least some of the buffer stacks in a given wafertransport assembly are configured so that wafers move through a givenbuffer stack only once. In some implementations, the system isconfigured so that wafers enter a given buffer stack from one side andexit the buffer stack from another side. For example, with continuedreference to FIG. 7, the buffer stack 242 might be configured so thatwafers enter from the side of the buffer stack 242 facing the wafertransport module 102 (the front-facing side), and exit from the sidefacing the wafer transport module 212 (the rear-facing side). In thismanner, wafers move from the wafer transport module 102 to the wafertransport module 212 via transport in a one-way fashion through thebuffer stack 242. By having wafers move through the buffer stacks in aone-way fashion, wafers do not return to the same buffer stack, and thepossibility for cross-contamination from different processes is reduced.

Extending the concept with continued reference to FIG. 7, the bufferstacks 242 and 246 might be configured so that wafers move through eachof them from the front-facing side to the rear-facing side, whereas thebuffer stacks 244 and 240 are configured so that wafers move througheach of them in the opposite manner, from the rear-facing side to thefront-facing side. Conceptually, the wafer transport modules and thebuffer stacks thus define a pathway for wafers through the wafertransport assembly and/or the cluster tool system.

By way of example without limitation, a pathway can be defined for awafer from the loadlock 700, to the wafer transport module 102, to thebuffer stack 242, to the wafer transport module 212, to either of theprocess modules 210 or 214, to the wafer transport module 212, to thebuffer stack 240, to the wafer transport module 102, to the loadlock208.

As another example, a pathway can be defined for a wafer from theloadlock 700, to the wafer transport module 102, to the buffer stack242, to the wafer transport module 212, to the buffer stack 246, toeither of the process modules 216 or 220, to the wafer transport module218, to the buffer stack 244, to the wafer transport module 212, to thebuffer stack 240, to the wafer transport module 102, to the loadlock208.

In some implementations, certain buffer stacks are designated as inputbuffer stacks utilized for temporary storage of wafers that are to betransported to a process module for processing, whereas other bufferstacks are designated as output buffer stacks utilized for temporarystorage of wafers that have been processed and which are to betransported out of the system. For example, in the illustratedimplementation, the buffer stacks 242 and 246 might be designated asinput buffer stacks, whereas the buffer stacks 240 and 244 might bedesignated as output buffer stacks. This allows for the input path of awafer to be separately defined from the output path for the wafer, whichcan aid in the avoidance of cross-contamination and bottlenecks.

The above discussion concerning the pathways and usage of buffer stacksis provided by way of example without limitation. It should beappreciated that the buffer stacks of the present disclosure, which aredefined in the same controlled environment (e.g. vacuum) as the wafertransport modules, can be flexibly deployed and utilized in any suitablemanner to achieve efficient storage and movement of wafers through thecluster tool system.

FIG. 8 illustrates a cross section view of a portion of a cluster toolsystem, in accordance with implementations of the disclosure. In theillustrated implementation, a pair of load locks 800 and 802 arearranged in a side-by-side configuration and connected between the wafertransport module 102 and the EFEM 200. Each of load locks 800 and 802may be a dual slot load lock, each having two slots that can be utilizedfor wafer transfer between the EFEM and the wafer transport module 102.In such a configuration, the load locks together provide the capacity tohandle four wafers simultaneously. In some implementations, one of theload locks can be utilized for wafers entering the wafer transportassembly, whereas one of the load locks can be utilized for wafersexiting the wafer transport assembly.

FIG. 9 conceptually illustrates a configuration of load locks withintegrated post-processing modules, in accordance with implementationsof the disclosure. The load locks 800 and 802 are arranged in aside-by-side configuration. Load lock 800 includes slots 900 and 902,and load lock 802 includes slots 904 and 906, each of the slots beingconfigured for transfer of a wafer into or out of the wafer transportassembly.

Additionally, post-processing modules 908 and 910 are vertically stackedwith the load locks 800 and 802, respectively. In variousimplementations, the post-processing modules can be configured toperform a post-processing operation on a processed wafer, such as astrip operation or a passivation operation. In the illustratedimplementation, the post-processing modules 908 and 910 are positionedabove the load locks 800 and 802, respectively, but in otherimplementations, the post-processing modules 908 and 910 can bepositioned below the load locks 800 and 802, respectively. Thepost-processing modules 908 and 910 can be configured to perform a stripor passivation operation on a processed wafer, prior to the processedwafer exiting the wafer transport assembly. The post-processing modules908 and 910 open to the interior of the wafer transport assembly.

Thus by way of example, with reference to the system of FIG. 2, aprocessed wafer may be placed into one of the post-processing modules bythe wafer transport module 102. After completion of the post-processing(e.g. strip or passivation) operation, the wafer is removed from thepost-processing module by the wafer transport module 102, and placedinto a wafer slot in one of the load locks 800 or 802, to be transportedout of the wafer transport assembly 209 to the EFEM 200.

It should be appreciated that implementations of the present disclosureare applicable to any of various sizes of substrates, including 200 mm,300 mm, and 450 mm substrates, and non-standard sizes and shapes,including square substrates.

FIG. 10 shows a control module 1000 for controlling the systemsdescribed above. For instance, the control module 1000 may include aprocessor, memory and one or more interfaces. The control module 1000may be employed to control devices in the system in accordance withpredefined programming and based in part on sensed values, including anyof the aforementioned components of a cluster tool system, includingwithout limitation, an EFEM, a load lock, a post-processing module, awafer transport module, a wafer orienter, and a process module. Itshould be appreciated that the control module 1000 may control any typeof operation for which a given component is defined or capable ofperformance, in accordance with implementations of the disclosure.

For example only, the control module 1000 may control one or more ofvalves 1002, actuators 1004, pumps 1006, RF generators 1022, and otherdevices 1008 based on the sensed values, predefinedprogramming/instructions and other control parameters. The controlmodule 1000 receives the sensed values from, for example only, pressuremanometers 1010, flow meters 1012, temperature sensors 1014, and/orother sensors 1016.

With respect to a given process module, the control module 1000 may alsobe employed to control process conditions during reactant/precursordelivery and plasma processing. The control module 1000 will typicallyinclude one or more memory devices and one or more processors.

The control module 1000 may control activities of the reactant/precursordelivery system and plasma processing apparatus. The control module 1000executes computer programs including sets of instructions forcontrolling process timing, delivery system temperature, pressuredifferentials across the filters, valve positions, mixture of gases,chamber pressure, chamber temperature, wafer temperature, RF powerlevels, wafer chuck or pedestal position, and other parameters of aparticular process. The control module 1000 may also monitor thepressure differential and automatically switch vapor precursor deliveryfrom one or more paths to one or more other paths. Other computerprograms stored on memory devices associated with the control module1000 may be employed in some embodiments.

Typically there will be a user interface associated with the controlmodule 1000. The user interface may include a display 1018 (e.g. adisplay screen and/or graphical software displays of the apparatusand/or process conditions), and user input devices 1020 such as pointingdevices, keyboards, touch screens, microphones, etc.

Computer programs for controlling delivery of precursor, plasmaprocessing and other processes in a process sequence can be written inany conventional computer readable programming language: for example,assembly language, C, C++, Pascal, Fortran or others. Compiled objectcode or script is executed by the processor to perform the tasksidentified in the program.

The control module parameters relate to process conditions such as, forexample, filter pressure differentials, process gas composition and flowrates, temperature, pressure, plasma conditions such as RF power levelsand the low frequency RF frequency, cooling gas pressure, and chamberwall temperature.

The system software may be designed or configured in many differentways. For example, various chamber component subroutines or controlobjects may be written to control operation of the chamber componentsnecessary to carry out the inventive deposition processes. Examples ofprograms or sections of programs for this purpose include substratepositioning code, process gas control code, pressure control code,heater control code, and plasma control code.

A substrate positioning program may include program code for controllingchamber components that are used to load the substrate onto a pedestalor chuck and to control the spacing between the substrate and otherparts of the chamber such as a gas inlet and/or target. A process gascontrol program may include code for controlling gas composition andflow rates and optionally for flowing gas into the chamber prior todeposition in order to stabilize the pressure in the chamber. A filtermonitoring program includes code comparing the measured differential(s)to predetermined value(s) and/or code for switching paths. A pressurecontrol program may include code for controlling the pressure in thechamber by regulating, e.g., a throttle valve in the exhaust system ofthe chamber. A heater control program may include code for controllingthe current to heating units for heating components in the precursordelivery system, the substrate and/or other portions of the system.Alternatively, the heater control program may control delivery of a heattransfer gas such as helium to the wafer chuck.

Examples of sensors that may be monitored during processing include, butare not limited to, mass flow control modules, pressure sensors such asthe pressure manometers 1010, and thermocouples located in deliverysystem, the pedestal or chuck (e.g. the temperature sensors 1014).Appropriately programmed feedback and control algorithms may be usedwith data from these sensors to maintain desired process conditions. Theforegoing describes implementation of embodiments of the invention in asingle or multi-chamber semiconductor processing tool.

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention. Individual elements or features ofa particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and can be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the invention, and all such modificationsare intended to be included within the scope of the invention.

Although the foregoing embodiments have been described in some detailfor purposes of clarity of understanding, it will be apparent thatcertain changes and modifications can be practiced within the scope ofthe appended claims. Accordingly, the present embodiments are to beconsidered as illustrative and not restrictive, and the embodiments arenot to be limited to the details given herein, but may be modifiedwithin their scope and equivalents of the claims.

What is claimed is:
 1. A substrate processing tool, comprising: a wafertransport assembly including a first wafer transport module, wherein thewafer transport assembly extends along a longitudinal axis of thesubstrate processing tool; a plurality of process modules including afirst process module and a second process module arranged on oppositesides of the longitudinal axis of the substrate processing tool, whereinouter sides of the first wafer transport module are coupled to the firstand second process modules, respectively; and a service tunnel definedbelow the wafer transport assembly, wherein the service tunnel extendsalong the longitudinal axis from a front end of the substrate processingtool to a rear end of the substrate processing tool below the wafertransport assembly, wherein the service tunnel has a vertical dimensiondefined between an underside of the wafer transport assembly and aservice floor that is positioned below the wafer transport assembly. 2.The substrate processing tool of claim 1, wherein the vertical dimensionof the service tunnel is in a range from 183 cm to 244 cm.
 3. Thesubstrate processing tool of claim 1, wherein the service floor isdefined at a height that is less than a height of a fabrication facilityfloor.
 4. The substrate processing tool of claim 3, wherein the heightof the service floor is between 30.5 cm to 61 cm below the height of thefabrication facility floor.
 5. The substrate processing tool of claim 1,wherein: the wafer transport assembly includes a second wafer transportmodule; the plurality of process modules includes a third process moduleand a fourth process module arranged on opposite sides of thelongitudinal axis of the substrate processing tool, wherein outer sidesof the second wafer transport module are coupled to the second and thirdprocess modules, respectively; and the first wafer transport module andthe second wafer transport module define a continuous wafer transportvolume providing a controlled environment within the wafer transportassembly.
 6. The substrate processing tool of claim 5, furthercomprising: a buffer module arranged between the first wafer transportmodule and the second wafer transport module in the continuous wafertransport volume within the wafer transport assembly.
 7. The substrateprocessing tool of claim 6, wherein the buffer module includes a firstbuffer stack.
 8. A substrate processing tool, comprising: a wafertransport assembly including a first wafer transport module, wherein thewafer transport assembly extends along a longitudinal axis of thesubstrate processing tool; a plurality of process modules including afirst process module and a second process module arranged on oppositesides of the longitudinal axis of the substrate processing tool, whereinouter sides of the first wafer transport module are coupled to the firstand second process modules, respectively; a service tunnel defined belowthe wafer transport assembly, wherein the service tunnel extends alongthe longitudinal axis from a front end of the substrate processing toolto a rear end of the substrate processing tool below the wafer transportassembly, wherein the wafer transport assembly includes a second wafertransport module, the plurality of process modules includes a thirdprocess module and a fourth process module arranged on opposite sides ofthe longitudinal axis of the substrate processing tool, wherein outersides of the second wafer transport module are coupled to the second andthird process modules, respectively, and the first wafer transportmodule and the second wafer transport module define a continuous wafertransport volume providing a controlled environment within the wafertransport assembly; and a buffer module arranged between the first wafertransport module and the second wafer transport module in the continuouswafer transport volume within the wafer transport assembly, wherein thebuffer module includes a first buffer stack, and wherein a first portionof the first buffer stack defines a first plurality of wafer storageslots and includes one or more separators defined between each of thefirst plurality of wafer storage slots, and wherein a second portion ofthe first buffer stack defines a second plurality of wafer storage slotsthat does not include separators defined between each of the secondplurality of wafer storage slots.
 9. The substrate processing tool ofclaim 8, wherein at least one of the first wafer transport module andthe second wafer transport module stores at least one of a seasoningwafer and a cover wafer in the second portion of the first buffer stackand at least one of a processed wafer and an unprocessed wafer in thefirst portion of the first buffer stack.
 10. The substrate processingtool of claim 7, further comprising a second buffer stack, wherein: awafer transport assembly including a first wafer transport module,wherein the wafer transport assembly extends along a longitudinal axisof the substrate processing tool; a plurality of process modulesincluding a first process module and a second process module arranged onopposite sides of the longitudinal axis of the substrate processingtool, wherein outer sides of the first wafer transport module arecoupled to the first and second process modules, respectively; a servicetunnel defined below the wafer transport assembly, wherein the servicetunnel extends along the longitudinal axis from a front end of thesubstrate processing tool to a rear end of the substrate processing toolbelow the wafer transport assembly, wherein the wafer transport assemblyincludes a second wafer transport module, the plurality of processmodules includes a third process module and a fourth process modulearranged on opposite sides of the longitudinal axis of the substrateprocessing tool, wherein outer sides of the second wafer transportmodule are coupled to the second and third process modules,respectively, and the first wafer transport module and the second wafertransport module define a continuous wafer transport volume providing acontrolled environment within the wafer transport assembly; and a buffermodule arranged between the first wafer transport module and the secondwafer transport module in the continuous wafer transport volume withinthe wafer transport assembly, wherein the buffer module includes a firstbuffer stack, wherein a first portion of the second buffer stack definesa first plurality of wafer storage slots and includes one or moreseparators defined between each of the first plurality of wafer storageslots, wherein a second portion of the second buffer stack defines asecond plurality of wafer storage slots that does not include separatorsdefined between each of the second plurality of wafer storage slots, andwherein at least one of the first wafer transport module and the secondwafer transport module stores at least one of an unprocessed wafer and aprocessed wafer in the first portion of the second buffer stack and atleast one of a seasoning wafer and a cover wafer in the second portionof the second buffer stack.
 11. The substrate processing tool of claim5, further comprising: at least two pairs of process module framesconfigured to support the first process module, the second processmodule, the third process module, and the fourth process module alonglateral sides of the wafer transport assembly above a fabricationfacility floor.
 12. The substrate processing tool of claim 1, whereinthe wafer transport assembly includes a first end oriented towards anequipment front end module (EFEM) and a second end opposite the firstend.
 13. The substrate processing tool of claim 12, wherein the firstend of the wafer transport assembly is configured for connection to aload lock that controls access to and from the EFEM, and wherein a firstend of the service tunnel extends substantially to the EFEM.
 14. Thesubstrate processing tool of claim 1, further comprising: a wafertransport assembly including a first wafer transport module, wherein thewafer transport assembly extends along a longitudinal axis of thesubstrate processing tool; a plurality of process modules including afirst process module and a second process module arranged on oppositesides of the longitudinal axis of the substrate processing tool, whereinouter sides of the first wafer transport module are coupled to the firstand second process modules, respectively; a service tunnel defined belowthe wafer transport assembly, wherein the service tunnel extends alongthe longitudinal axis from a front end of the substrate processing toolto a rear end of the substrate processing tool below the wafer transportassembly; at least two pairs of gas boxes arranged in the wafertransport assembly and configured to deliver gas mixtures to the firstand second process modules; and an exhaust duct arranged to selectivelyevacuate the first and second process modules, wherein the at least twopairs of gas boxes include perforations along surfaces thereof such thatgases are evacuated from the at least two pairs of gas boxes to theexhaust duct.
 15. The substrate processing tool of claim 14, furthercomprising: a plurality of gas lines configured to supply gas mixturesto the at least two pairs of gas boxes, wherein each of the plurality ofgas lines runs through the exhaust duct to the at least two pairs of gasboxes.
 16. The substrate processing tool of claim 15, wherein each ofthe plurality of gas lines runs in the exhaust duct from a regionoutside of the wafer transport assembly to a region inside of the wafertransport assembly.